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Interface Materials
THERM-A-GAP™ – The ThermaGap family of thermal interface materials fill air gaps between components or PC boards and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket uneven surfaces, transferring heat away from individual components or entire boards, and allowing chassis parts to be used as heat spreaders where space is restricted.
http://www.chomerics.com/products/therm_gapfillers.htm
THERMATTACH® - The Thermattach family of thermally conductive adhesive tapes is used extensively to bond heat sinks to microprocessors and other power dissipating semiconductors. Offered with a choice of aluminium oxide or titanium diboride fillers coated on Kapton film, aluminium foil, fiberglass or expanded aluminium, these tapes combine exceptional bonding strength with low thermal impedance to effectively replace thermal grease and mechanical fasteners.
http://www.chomerics.com/products/therm_thermattach.htm
CHO-THERM® - ChoTherm thermal interface pads conform to uneven surfaces to lower the thermal resistance between hot components and heat sinks. These advanced materials utilize silicone resins filled with boron nitride or aluminium oxide particles to achieve a range of thermal performance levels. Easy to handle and apply, ChoTherm pads can provide electrical insulation while improving the thermal management of electronic systems, and lowering assembly costs.
http://www.chomerics.com/products/therm_chotherm.htm
THERMFLOW – The ThermFlow family of phase-change materials combine the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease.
http://www.chomerics.com/products/therm_thermflow.htm
THERM-A-FORM™ - These form in place, flexible elastomer compounds minimize stress on components. Available in a range of kit sizes for manual and pneumatic dispensing.
http://www.chomerics.com/products/therm_silicone_compounds.htm
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