THERM-A-GAP™ – The ThermaGap family of thermal interface materials fill air gaps between components or PC boards and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket uneven surfaces, transferring heat away from individual components or entire boards, and allowing chassis parts to be used as heat spreaders where space is restricted. It is often referred to as a gap filler or gap pad.

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