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A common question often asked by our customers is the reason why flow rate is reported on datasheets of liquid-dispensed thermal interface materials instead of viscosity. And it’s a fair question; viscosity is a fundamental property of fluids such as thermally conductive pastes. But measuring viscosity, however, is more complicated than meets the eye.
The world of thermal interface materials continues to evolve as the cooling requirements for applications in the automotive, consumer, medical and aerospace markets continue to demand lower prices and higher performance. As each new product generation requires higher power in smaller packages the challenges associated with thermal management become more intense. So which is the best product for your application? Here are the top four thermal interface materials.
Most thermal pads, also known as thermally conductive gap filler pads, thermal gap pads, or thermal gap filler pads, have many different layer materials or carrier substrate options to choose from. It can be confusing which layer is supposed to stay on the product and which layer gets peeled off and removed before application. In fact, it’s one of our customer’s most asked about questions and can cause a lot of confusion on the manufacturing floor.
So, which layer should you peel off and which should stay on the thermal gap pad? Read on to find out.
Finding The Right Elastomer EMI Gasket For You - Parker Chomerics EMI shielding elastomer gaskets are the superior choice for elastomeric seals, corrosion resistance, environmental sealing, and cost effective electronic shielding. Read more to find the right choice for you.
There are two key processes used to create conductive elastomer gaskets: splicing and molding. Do you know the differences? Read more to find out what's best for your application!
There are many electromagnetic interference (EMI) shielding elastomer gasket mounting techniques that offer designers reliable, cost-effective choices in both materials and component assembly. Take a look at the list we've compiled of the seven most common elastomer EMI shielding gasket mounting systems.
Sometimes, applying conductive EMI foil masking tapes can be tricky and quite the hassle. Luckily, we’ve come up with five easy steps to make applying conductive tape easy and worry-free.
When approaching the problem of electromagnetic compatibility (EMC) the electronic design engineer quite often considers it to be a secondary issue that can be dealt with once the device is working and, after all, it can be dealt with by putting a metal box around it!
Designing a custom vent with additional EMI shielding and weather sealing gaskets for a mobile ground radar unit
Selecting the right EMI shielding material for your application can be challenging. The Conductive Elastomer Engineering Handbook published by Parker Chomerics offers detailed technical explanations...
Pressure sensitive adhesive, more commonly known as PSA, is adhesive which forms a bond when pressure is applied, to join the adhesive with an EMI gasket. As the name "pressure-sensitive" indicates, the degree of bond is influenced by the amount of pressure which is used to apply the adhesive to the surface.
In early 2013 JHC started working closely with CSIRO on a thermal transfer concept to remove heat load from the PAF component of the ASKAP telescope design. With the expertise of our passive thermal transfer solutions partner in Thermacore Europe, a complex heatpipe derived solution evolved to meet CSIRO’s cooling specification. This resulted in an enormous reduction in long term running costs for ASKAP. The last of 36 complete systems was supplied by JHC in mid-2016
Designing a STREAMSHIELD style frame featuring a single layer of 1/8” cell aluminum honeycomb to allow for airflow to be maximised.
Designing the right EMI shielding honeycomb vent for your application can be challenging. Many design variables should be considered when developing an EMI shielding honeycomb vent design.
This Application and Design Guide to EMI Shielding Honeycomb Vents published by Parker Chomerics offers detailed technical specifications and helpful design application assistance.
Discover why the polarity principle is so important to understand when picking a honeycomb air vent panel for EMI shielding.
Extend the life of your electronics! Download the Thermal Interface Materials For Cooling Electronics Product Guide and discover which thermal interface material is best suited to your application.
There are a variety of thermal pads and gap fillers to choose from -- so many choices that it can become so overwhelming. How can you decide what's best for your application? And how does quality come into play? Read on, we answer these questions and much more.
Comparing different TIMs for a specific application, you can begin with thermal conductivity for general comparisons, but having thermal impedance versus pressure data will be far more accurate to your “real world” conditions.
As the defence industry continues to push the boundaries on advanced electronic systems and state-of-the-art communication devices, the requirements governing these programs must follow suit.
Every design engineer should know that an EMI gasket must be installed between mating flanges to prevent electromagnetic radiation (EMI) from entering or leaving an electronic enclosure. But what if your equipment will be used in humid or tempest environments? How confident are you in your design that corrosion protection will be addressed? Not so much? Then here are our top three design tips for ensuring corrosion resistant EMI protection.
Did you know that up to 80% of conductive coating failures can be directly attributed to inadequate surface preparation? Discover the correct surface preparation needed for a successful conductive paint application now!
JHC have been advised by Parker Chomerics of the discontinuation of their Soft Shield 5000 series gaskets.
JHC is pleased to announce recognition as the exclusive partner for HALA Thermal Interface Materials within Australasia.
Optical Filters has developed Viz-Bond®, a wet bonding system that cures to a gel, to deliver a cost effective, scalable system in which the components are processed at ambient temperature without the use of vacuum, temperature, pressure and need for multiple tooling.